Vibration Analysis for Electronic Equipment
by: Dave S. Steinberg
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Topics include: reverse octave rule, peak sinusoidal vibration input, side wedge clamps, uncoupled transmissibility, approximate fatigue life, forward octave rule, wire fatigue life, coupling effects between the chassis, shock acceleration levels, side edge guides, resonant dwell, kovar wire, sinusoidal vibration environment, cumulative fatigue damage ratio, shock amplification factor, peak sine vibration, electrical lead wires, chassis resonance, random vibration input, sound pressure response, million cycle fatigue life, total dynamic load, random vibration fatigue, zero rebound, dynamic forces and stresses
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From Book News, Inc. -- Without noting the dates for the first two, Steinberg (U. of California-Los Angeles) has made extensive changes in the third edition to reflect the dramatic reduction in electronics that makes them affordable in many applications that were once good enough as mechanical devices. A major concern of his is the adoption of commercial equipment and standards by the military. Among the new chapters are discussions of the effects of manufacturing methods and tolerances on the reliability of the electronic hardware, methods for improving the ruggedness of commercial hardware for improved reliability in harsh military environments, the bending distortion of the circuit board at its resonant condition, and environmental stress screening.Book News, Inc.Portland, OR
The publisher, John Wiley and Sons -- A practical guide to quick methods for designing electronic equipment that must withstand severe vibration and shock--and the only book that shows how to predict the operational life of electronic equipment, based on the component type and type of vibration and shock exposure. This 2nd Edition presents new material, never published before, on predicting fatigue life in sinusoidal vibration, random vibration and acoustic noise, and pyrotechnic shock. Each new concept is given one or more detailed sample problems, and there is extensive coverage of testing methods. Treatment is kept as simple as possible (consistent with the important governing equations), with emphasis on actual, currently-used hardware.--This text refers to an out of print or unavailable edition of this title.
Book Description -- This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.
Reviews:
Book Info -- Contents include a list of symbols, vibrations of simple electronic systems, component lead wire and solder joint vibration fatigue life, beam structures for electronic subassemblies, component lead wires as bents, frames, and arcs, octave rule, snubbing, and damping, and much more DLC: Electronic apparatus and appliances--Vibration.
A tool for success -- If a mechanical engineer has chosen a career in the world of electronics, I strongly recommend this easy to follow gold mine of a book. I say it is a gold mine because it applies directly to the engineers' job. There are no fluff chapters or topics. Everything applies. Steinberg has made it easy (and almost fun) to solve those every day shock, vibration and acoustic challenges. Finding the natural frequency of a body such as a PC board is so much simpler for me now. And a surprising tidbit was for me to discover some amazing facts concerning acoustics. This is especially important as applied to fan cooled electronic packages. Another important area of study was packaging for transportation. How many times have we simply said "Just pack it in foam"? Before reading this book, I couldn't be sure what foam density to use or what the optimum thickness was. Why guess? Do it right. I borrowed this book from my employer, took it home and read it over the long Christmas weekend. I was so impressed, that I am purchasing my personal copy tonight. I won't be without it.
Application beyond just electronics -- The author is obviously an engineer who understands the everyday practical problems a dynamicist faces. Some theory, but chock full of easy to understand, and more importantly, *useful* information necessary to put properly designed product out the door. Don't let the title fool you. The focus of this book is electronics, but the material here is applicable to any vibration problem. If you're doing any dynamics work, you NEED this book.
This Book is to the point, get it done, structural dynamics. -- This reference is a must read for any structural engineer entering into the the electronic packaging world. You can't go wrong with the easy to understand examples and extra insight the book gives to the rapid engineering production world we live in today.