Contamination of Electronic Assemblies
by: Michael Pecht
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Topics include: ionic contamination test, boil sump, silver chromate paper, conductive filament formation, copper mirror test, laminate manufacturing, weave exposure, substrate manufacturer, acid activator, wave coating, conformal coatings, solder resist, surface insulation resistance, substrate manufacturing, flux removal, conductor traces, flux residues, end use environment, supplier document, aqueous cleaning, substrate fabrication, plating materials, supplier measure, vapor zone, clean fluxes
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Lists sources of contamination throughout the manufacturing process
Illustrates quality and reliability issues with photos and tables
Discusses aspects of contamination from the manufacture of the glass fibers used in the laminates to the complete assembly of the finished product
Targets defects encountered during the manufacturing process along with the contaminants causing those defects
Discusses how defects can be reduced through detection and control methods
Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of Electronic Assemblies presents a generalized overview of contamination problems and serves as a problem-solving reference point. It takes a step-by-step approach to identifying contaminants and their effects on electronic products at each level of manufacture.
The text is divided into four sections: Laminate Manufacturing, Substrate Fabrication, Printed Wiring Board Assembly, and Conformal Coatings. These sections discuss all aspects of contamination of electronic assemblies, from the manufacture of glass fibers used in the laminates to the complete assembly of the finished product. The authors present detection and control methods that can help you reduce defects during the manufacturing process. With tables, figures, and fishbone diagrams serving as a quick reference, Contamination of Electronic Assemblies will help you familiarize yourself with the origination, detection, measurement, control, and prevention of contamination in electronic assemblies.
Table of Contents
Preface
Introduction
PART 1 - LAMINATE MANUFACTURING
Chapter 1 Contaminant Sources in Laminates
1.1 Glass Fibers
1.2 Fiber Treatment Agents
1.3 Epoxy Resin
1.4 Copper Cladding
1.5 Volatile Matter
1.6 Summary of Contaminants
Chapter 2 Measuring Contaminants in Laminates
Chapter 3 Quality and Reliability of Laminates
3.1 Weave Exposure and Weave Texture
3.2 Pits and Microvoids
3.3 Measling and Crazing
3.4 Blistering and Delamination
3.5 Foreign Inclusions
3.6 Hollow Fibers
3.7 Conductive Filament Formation
3.8 Resin Reversion
Chapter 4 Control Methods in Laminate Manufacturing
4.1 Manufacturing Process Assessment
4.1.1 Quality Assurance Through Certification
4.1.2 Statistical Process Control
4.1.3 Optimization
4.1.4 Cleaning
4.1.5 Best Practices
4.2 Control Monitoring Through Testing
4.2.1 Visual Inspection
4.2.2 Glass Transition Temperature Testing
4.2.3 Flame Retardant Content Measurement
4.2.4 Prepreg Resin Content Measurement
4.2.5 Copper Foil Surface Inspection
4.3 Root Cause Analysis
4.3.1 Material Traceability
4.3.2 Corrective and Preventive Actions
4.3.3 Documentation
4.4 Supply Chain Assessment
4.4.1 Vendor Assessment
4.4.1.1 Consumables Applied during Manufacturing
4.4.2 Shipping, Handling, and Storage
PART 2 - SUBSTRATE FABRICATION
Chapter 5 Contaminant Sources in Substrates
5.1 Plant Air and Machinery
5.2 Abrasive Brushing
5.3 Chemical Pre-treatment
5.4 Imaging
5.5 Electroplating
5.6 Electroless and Immersion Plating
5.7 Etching
5.8 Tinning and Fusing Operations
5.9 Solder Masking
5.10 Drying
5.11 Handling and Packaging
5.12 Summary of Contaminants
Chapter 6 Measuring Contaminants in Substrates
Chapter 7 Quality and Reliability of Substrates
7.1 Nonwetting and Dewetting
7.2 Plating Voids
7.3 Haloing
7.4 Lifted Lands
7.5 Resist Deadhesion
7.6 Resist Blistering and Waving
7.7 Vesication
7.8 Soda Strawing
7.9 Blistering
7.10 Delamination
7.11 Particle Contamination
Chapter 8 Control Methods in Substrate Manufacturing
8.1 Manufacturing Process Assessment
8.1.1 Quality Assurance Through Certification
8.1.2 Statistical Process Control
8.1.3 Cleaning
8.1.4 Best Practices
8.2 Control Monitoring through Testing
8.2.1 Visual Inspection
8.2.2 Automated Optical Inspection
8.2.3 Plated Through Hole Reliability Test
8.2.4 Insulation Reliability Testing
8.2.5 Electrical Continuity Testing
8.3 Physics of Failure Based Root Cause Analysis
8.3.1 Material Traceability
8.3.2 Corrective and Preventive Actions
8.3.3 Documentation
8.4 Supply Chain Assessment
8.5 Shipping, Handling, and Storage
PART 3 - PRINTED WIRING BOARD ASSEMBLY
Chapter 9 Contamination Sources in Printed Wiring Assemblies
9.1 Receiving and Handling
9.1.1 Fingerprints
9.1.2 Gloves
9.1.3 Food, Drink, and Tobacco
9.1.4 Airborne Particles
9.1.5 Tools
9.1.6 Fault Markers
9.2 Storage
9.3 Components
9.4 Assembly
9.4.1 Temporary Masking
9.4.2 Component Mounting
9.4.3 Fluxing
9.4.3.1 Rosin
9.4.3.2 Water-Soluble
9.4.3.3 Synthetic Activated
9.4.3.4 Low Solids
9.4.4 Soldering
9.4.4.1 Blowholes
9.4.5 Cleaning
9.4.6 Conformal Coating
9.4.7 Testing
9.4.8 Repair and Rework
9.5 Use Conditions
Chapter 10 Measuring Contaminants in Printed Wiring Assemblies
10.1 Testing for Ionics
10.1.1 Ionic Contamination Test
10.1.2 Ion Chromatography
10.1.3 Omega Meter and Ionograph
10.2 Testing for Nonionics
10.2.1 High-performance Liquid Chromatography
10.2.2 Ultraviolet/Visible Spectrophotometry
10.2.3 Coulometry
10.2.4 Turbidimetry
10.3 Surface Insulation Resistance Test
10.4 Electromigration Test
Chapter 11 Quality and Reliability of Printed Wiring Assemblies
11.1 Flux Residues
11.2 Particulate Matter
11.3 White Residues
11.4 Corrosion
11.5 Solder Voids
11.6 Coating Deadhesion
11.7 Black Pad
Chapter 12 Contamination Removal
12.1 Abrasive Cleaning
12.2 Solvent Cleaning
12.2.1 Alcohols
12.2.1.1 Methyl Alcohol
12.2.1.2 Ethyl Alcohol
12.2.1.3 Isopropyl Alcohol
12.2.2 Ketones
12.2.3 Hydrocarbons
12.2.4 Terpenes
12.2.5 Halogenated Solvents
12.2.5.1 Chlorinated
12.2.5.2 Fluorinated
12.2.5.3 Decomposition
12.2.6 Solvent Cleaning Equipment
12.2.7 Safety and Environmental Concerns
12.2.8 Solvent Alternatives
12.3 Aqueous Cleaning
12.3.1 Water
12.3.2 Neutralizers and Rinse Aids
12.3.3 Saponifiers
12.3.4 Defoamers
12.3.5 Surfactants
12.3.6 Equipment
12.4 Semiaqueous Cleaning
12.5 Emulsion Cleaning
12.6 Ultrasonic Cleaning
12.7 Plasma Cleaning
12.8 Selecting a Cleaning Method
12.9 Drying
12.9.1 Heat
12.9.2 Vacuum
12.10 No Clean
PART 4 - CONFORMAL COATINGS
Chapter 13 Conformal Coatings
13.1 Types of Conformal Coatings
13.1.1 Urethanes (UR)
13.1.2 Silicone (SR)
13.1.3 Acrylic (AR)
13.1.4 Epoxy (ER)
13.1.5 Parylene (XY)
13.1.6 Material Properties
13.2 Application Techniques
13.2.1 Brush
13.2.2 Dip
13.2.3 Spray
13.2.4 Wave
13.2.5 Vacuum Deposition
13.2.6 Needle Based Selective Dispensing Systems
13.2.7 Summary of Application Techniques
13.3 Curing Methods
13.3.1 Ultraviolet
13.3.2 Two-component
13.3.3 Thermal
13.3.4 Moisture
13.4 Coating Removal
13.4.1 Chemical
13.4.2 Mechanical
13.4.3 Abrasive
13.4.4 Thermal
13.4.5 Laser
13.4.6 Plasma Etching
13.5 Reliability of Conformal Coatings
13.6 Environmental Concerns
13.7 Selection Trade-Offs
Glossary
References
Index
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